Printed circuit boards are exciting things. Every day, you allow us to manufacture our own printed circuit boards that use everything from personal electronics to airplanes and robots for research projects. He has our responsibility to deliver high-quality products for these important projects. There are several unique steps in the PCB manufacturing process. This tutorial for making boards, you will pass our PCB manufacturing process, step by step, for a two-sided PCB.
Step 1: The Generation Film
Films for all copper and solder mask layers are made with a photographic way exposed to mylar. We generate these movies in the design files, creating the exact movie (1: 1) representing your design. When sending Gerber files, each single Gerber file represents one layer of the PCB.
Step 2: Select The Raw Material
The industry’s standard 0.059 “thick FR-4 copper laminate is clad on two sides. The panels will be sized to accommodate many boards.
Step 3: Drill Holes
Through the holes required for your printed circuit boards are created based on the files provided, using an automated drill and a carbide drill.
Step 4: Electroless Copper
For that, through the openings electrically connect to different layers of OSS a thin layer of copper chemically deposited through the openings. This copper will later be thickened through electrolytic copper, coating (step 6).
Step 5: Apply The Photo To Resist And The Image
To send on printed circuit boards with electronic CAD data to the physical printed circuit board, let’s start by using a photosensitive photo to resist a panel covering the whole board of the area. Then the film copper layer of the image (step 1) is placed overboard, the source of high-intensity ultraviolet light subjected detected part of the photo-resist. Then we chemically develop the board (remove the unexposed Photos-resist from the panel) creating pads and tracks.
Step 6: Template Form
This step is the electrochemical process, which builds copper thickness in the holes and on the surface of the PCB. Once the copper thickness is built on the circuit and holes, we are lamellar and an additional layer of tin is exposed on the surface. This IPN protects silvered copper in the process of digestion (step 7) and later removed.
Step 7: Save & Etch
This process takes place in a few steps. First, to chemically remove (strips) the photoresist from the panel. Then again copper is chemically removed (dirty) using the panel. The tin applied in step 6 protects the desired copper electrical circuitry of the sensors from being dirty. At the moment, there are identified the fundamental schematics of OSB. Finally, the protective layer of tin is chemically removed (stripped) to expose the copper electrical circuitry of the sensors.
Step 8: Solderermask
Next, we coat a full layer of the liquid solder mask layer. With the help of films and high-intensity ultraviolet radiation (similar to step 5), we subjected to solderable areas on a printed BOARD. The main function of solder mask is to protect most copper electrical circuits of sensors from oxidation, damage, and corrosion, as well as to maintain the insulation of the assembly chains.
Step 9: Nomenclature (Silk Screen)
Next, we print link designators, logos and other information contained in the electronic files in the panel. This process is very similar to ink-jet printing process but is specially developed for PCBs.
Step 10: The Surface Is Applied
Final surface treatment is then applied to the panel. This surface (tin/lead solder or silver immersion) is used to protect against oxidation of copper (solderable surface), and also act as a site for soldering components on a printed circuit board.
Step 11: Manufacturing
Last but not least, we route along the perimeter of the PCB from the panel is larger by means of NC equipment. OSS is now complete and quickly sent to you – our lucky client!